Integrated Circuits: Market Dynamics and Evolution of Supply Structure·· A fire accident occurred at ATX, a packaging factory in Weihai, China. The factory is supplied to many leading IC (integrated circuit) manufacturers such as Toshiba (Toshiba) and Texas Instruments (Texas Instruments). In the spot market, Toshiba products (especially MOSFETs (field-effect transistors) have experienced slight price fluctuations. Network Cards: Continuous shortage and production suspension notice· Mellanox's CX7 series network cards were delayed in delivery. Affected by the shortage of raw materials caused by the Iran-Israel conflict, the delivery situation has further deteriorated, and the current delivery cycle has been extended from September 2025 to November. CPUs (Central Processor): Price fluctuations and distribution challenges · The supply of Intel's Ice Lake series has improved slightly, and delivery is expected to be gradually resumed from late July to August.
· Driven by strong demand for high-core processors in the European and American markets, demand for Turin series under AMD (USS Super Semiconductor Corporation) has risen.
· Intel's Xeon traditional platform CPU (central processing unit) has issued EOL (discontinuation notice). Although there is still supply, the difficulty of spot purchase has increased significantly.
· Intel's Alder Lake desktop-grade CPU (Central Processor) has been tight due to active spot market trading and prices have also risen.
·The 13th generation Raptor Lake H/HX gaming mobile CPU (central processor) also has a supply gap.
· The demand for the fourth generation of Sapphire Rapids CPUs (central processors) is rising.
FGs: Strong demand for Jetson series · Affected by ongoing demand, the shipment of Jetson series in multiple batches may be delayed until the end of the year. · Several customers have reported that NVIDIA's 8GB/16GB capacity Jetson Orin NX has voltage-related quality problems. GPUs (graphics processors): strategic allocation and market fluctuations · Demand for high-end data center GPUs (graphics processors) surges.
· The 80GB capacity A100 has run out of stock.
· The 80GB and 94GB capacity H100 has entered a shutdown phase, with limited supply currently, and the current delivery cycle of the 94GB capacity H100 is 4 to 6 weeks.
· The 80GB capacity H100 with EOL (discontinuation notice) has continued to have quality problems, but transaction activity is still active.
· The delivery cycle of the Blackwell 4000/5000 series under Nvidia is far beyond expectations, and general supply is expected to be restored after August. DRAM (Dynamic Random Access Memory)/Memory Module: Market Bottleneck and the Transition to DDR5 Memory · The DDR4 Memory Market continues to shrink, the delivery cycle has been extended to early 2026, and the spot price has risen by 10% again.
· The supply shortage of DDR4 memory has accelerated the overall transition from the market to DDR5 memory. The price increase of DDR5 memory is relatively stable, ranging from 1% to 7% depending on the density of the specific product.
Samsung does not expect to release large inventory in the third quarter, and LPDDR4/4X has entered the phase of shutdown, and continued demand may lead to supply restrictions.
Hynix is expected to adjust prices between July 15 and 25, and supply restrictions remain.
RDIMM (Dual In-line Storage Module with Memory): Demand reconstruction and price pressure · The direct supply price of RDIMM (Dual In-line Storage Module with Memory) under Samsung is expected to rise by 20% to 30%. · Kingston has raised the price of DDR4 desktop-level DIMM (Dual In-line Storage Module) by 35%.
· DDR4 RDIMM (Dual Inline Storage Module) has tight supply, but demand is still strong, and the price of product modules with a capacity of 16/32/64GB continues to rise.
· UDIMMs (unbuffered dual inline memory modules) have grown in demand in the gaming field, and demand is stable in the standard desktop-level product field. SSD (Solid State Drive): Supply restricted and price increase · The supply of low-capacity enterprise-level SSD (Solid State Drive) continues to be tight.
· SSD (solid-state drive) manufacturers raise quarterly prices for products of various density by 5% to 8%. HDDs (mechanical hard disk): Capacity changes and delivery cycle extension · The transfer of AI (artificial intelligence) and cloud applications to HDDs (mechanical hard disks) with capacity above 18TB leads to a shortage of products with capacity below 16TB. · The current delivery cycle of products with a capacity of 2 to 8TB has exceeded 20 weeks.
Western Digital (Western Digital) confirmed that 20 to 26TB of large-capacity HDDs (mechanical hard drives) are in high demand, and the product prices have risen by 10% compared to last month.
"Passive components: Delivery cycle extension and distribution limit· Delivery cycle extension of Yageo resistors and Taiyo/Murata capacitors.
· The delivery cycle of passive components under Samsung has been extended from 8 to 12 weeks to 14 to 18 weeks. Although there is no comprehensive shortage announced, there is no doubt that the supply constraints are intensifying.
· Generative AI (Artificial Intelligence) and chip customization: The wave of AI (Artificial Intelligence) has accelerated the market's demand for performance-optimized chips, and has promoted investment in ASICs (application-specific integrated circuits), dedicated GPUs (graphics processors), OEMs (original equipment manufacturers) and telecom companies' self-developed chips.
· Intelligent Manufacturing Applications: Industry 4.0 tools such as AI (Artificial Intelligence)-driven predictive maintenance and digital twins are transforming fabs into data centers.
· Semiconductor Independent and Capacity Return: Global capacity return and government support programs in the semiconductor field have reshape the entire supply chain, focusing on the sustainability of the supply chain and zero-defect production.
· Innovation beyond Moore's Law: Current innovation focuses on materials science and heterogeneous integration—3D packaging, core particle technology, SiC (silicon carbide)/GaN (gallium nitride) applications, and emerging quantum and neuromorphic technologies. "
· Intel: Affected by performance evaluation, cost reduction and strategic adjustments, Intel has carried out a major restructuring and has now cut 15% to 20% of its foundry department's employees (the number of people has exceeded 10,000). CEO (CEO) Lip-Bu Tan admitted that Intel (Intel) has fallen out of the top ten semiconductor companies in the world. (*Selected from TOI Article report)
· NVIDIA: NVIDIA CEO (CEO) Jensen Huang actively promotes AI (artificial intelligence) technology in Washington and Beijing, confirming that NVIDIA is applying to resume the sale of H20 GPUs (graphics processors) to China and launches a fully compliant RTX PRO GPUs (graphics processors) for digital twin applications.
(*Selected from NVIDIA Blog Report)
· SK Hynix: Infinitesima AFM (atomic force microscopy) technology integrates the HBM4E stack to achieve high yield of 16-layer hybrid bonding. Hynix presented 12-layer HBM4 and HBM3E solutions at COMPUTEX (Taipei International Computer Exhibition) in 2025.
(*Selected from Bits & Chips Report)
· Infineon: Infineon is vigorously promoting mass production of 300mm GaN (gallium nitride) wafers, and the first batch of samples is expected to be delivered in the fourth quarter of 2025, thereby consolidating its leadership as an IDM (integrated device manufacturer) in the GaN (gallium nitride) field.
(*Selected from Infineon's official report)
Source: Fusion Electronics Official Account